Soldering

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a relatively low melting point. Soft soldering is characterized by the melting point of the filler metal, which is below 400 °C. more...

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The filler metal used in the process is called solder.

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal; it is distinguished from welding by the base metals not being melted during the joining process. In a soldering process, heat is applied to the parts to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity, and water-tightness for many uses. Soldering is an ancient technique that has been used practically as long as humans have been making items out of metal.

Applications

The most frequent application of soldering is assembling electronic components to printed circuit boards (PCBs). Another common application is making permanent but reversible connections between copper pipes in plumbing systems. Joints in sheetmetal objects such as food cans, roof flashing, rain gutters and automobile radiators have also historically been soldered, and occasionally still are. Jewelry and small mechanical parts are often assembled by soldering. Soldering is also used to join lead came and copper foil in stained glass work. Soldering can also be used to effect a semi-permanent patch for a leak in a container or cooking vessel.

Solders

Soldering filler materials are available in many different alloys for differing applications. In electronics assembly, the eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in performance to the eutectic) has been the alloy of choice. Other alloys are used for plumbing, mechanical assembly, and other applications.

A eutectic formulation has several advantages for soldering; chief among these is the coincidence of the liquidus and solidus temperatures, i.e. the absence of a plastic phase. This allows for quicker wetting out as the solder heats up, and quicker setup as the solder cools. A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures. Any differential movement during the plastic phase may result in cracks, giving an unreliable joint. Additionally, a eutectic formulation has the lowest possible melting point, which minimizes heat stress on electronic components during the soldering process.

Read more at Wikipedia.org